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Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions

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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]])
|-  
|-  
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Batch size
! General description
| Sputter deposition of NiV
| Sputter deposition of NiV
|-


|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
*Pieces or
*1x4" wafer or
*1x6" wafer
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
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|About 10Å to 5000Å
|About 10Å to 5000Å
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
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|-
|-
|-style="background:WhiteSmoke; color:black"
! Batch size
|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
*Pieces or
*1x4" wafer or
*1x6" wafer
|-
|-style="background:LightGrey; color:black"
! Allowed substrates
|   
* Silicon wafers
* Quartz wafers
* Pyrex wafers
|
* Silicon wafers
* Quartz wafers
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Allowed materials
!Allowed materials
|
|
* Silicon
* Silicon
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