Specific Process Knowledge/Thin film deposition/Deposition of Tantalum: Difference between revisions

@@ Line 14: / Line 14: @@
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+| E-beam deposition of Ta
-*Up to 1x4" wafers
+| Sputter deposition of Ta
-*smaller pieces
-|
-*Pieces or
-*1x4" wafer or
-*1x6" wafer
 |-
 |-
@@ Line 39: / Line 34: @@
 |~0.3Å/s
 |-
 |-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*Pieces or
+*1x4" wafer or
+*1x6" wafer
+|-
+|-style="background:LightGrey;  color:black"
 !Allowed materials
@@ Line 63: / Line 70: @@
 * Carbon
-|-style="background:LightGrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 ! Comment
 |