Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

@@ Line 23: / Line 23: @@
 |-style="background:WhiteSmoke; color:black"
 ! Batch size
-|
+| E-beam deposition of Ag
-*Up to 1x4" wafers
+| Thermal deposition of Ag
-*smaller pieces
+| E-beam deposition of Ag
-|
+| Sputter deposition of Ag
-*6x6" wafers or
+| Sputter deposition of Ag
-*6x4" wafers or
-*24x2" wafers
-|
-*4x6" wafers or
-*12x4" wafers or
-*12x2" wafers
-|
-*4x6" wafers or
-*12x4" wafers or
-*12x2" wafers
-|
-*6x6" wafers or
-*6x4" wafers or
-*24x2" wafers
 |-
 |-style="background:LightGrey; color:black"
@@ Line 72: / Line 58: @@
 |Depending on process parameters (see logbook)
 |-
 |-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*6x6" wafers or
+*6x4" wafers or
+*24x2" wafers
+|
+*4x6" wafers or
+*12x4" wafers or
+*12x2" wafers
+|
+*4x6" wafers or
+*12x4" wafers or
+*12x2" wafers
+|
+*6x6" wafers or
+*6x4" wafers or
+*24x2" wafers
+|-style="background:Lightgrey; color:black"
 !Allowed materials
 |
@@ Line 119: / Line 130: @@
 * SU-8
 * Metals
-|-style="background:LightGrey; color:black"
+|-style="background:whitesmoke; color:black"
 ! Comment
 |