Specific Process Knowledge/Wafer cleaning: Difference between revisions
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Generel description | !Generel description | ||
|Two step process to remove organics and metals | |Two step process to remove traces of organics and metals | ||
|Removes organics and alkali ions | |Removes traces of organics and alkali ions | ||
|Removing native oxide | |Removing native oxide | ||
|Removing dust, organics and alkali ions and slightly polish the surface. | |Removing dust, traces of organics and alkali ions and slightly polish the surface. | ||
Make the surface hydrophillic | Make the surface hydrophillic | ||
|Removing dust and particles | |Removing dust and particles | ||