Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
| Line 58: | Line 58: | ||
|About 1Å/s | |About 1Å/s | ||
|About 10 to 250 Å/s | |About 10 to 250 Å/s | ||
|-style="background:WhiteSmoke; color:black" | |||
!Allowed materials | |||
| | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon | |||
* Silicon oxide | |||
* Silicon nitride | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
| | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
|- | |- | ||
|- | |- | ||
|-style="background: | |-style="background:LightGrey; color:black" | ||
! Comment | ! Comment | ||
| Thicknesses above 200 nm requires special permission | | Thicknesses above 200 nm requires special permission | ||