Specific Process Knowledge/Lithography/Coaters: Difference between revisions

← Older edit Newer edit →

VisualWikitext

@@ Line 559: / Line 559: @@
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
 All cleanroom materials except III-V materials
+|-
+|style="background:LightGrey; color:black"|Batch
+|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|-
+|}
+<br clear="all" />
+==III-V Spinner==
+[[Image:3-5 spinner.jpg|200x200px|thumb|III-V Spinner positioned in A-5]]
+'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#III-V_Spinner click here]'''
+The III-V spinner is a SÜSS RC8 Spin Coater intended for processing of III-V compound semiconductors and CMOS compatible materals. Please note, that '''there are different chucks for III-V materials and Si-, SiO2-materials.''' The spinner is mounted in a flow hood located in the III-V laboratory (yellow room). The extra exhaust should always be turned on while spinning.
+'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=140 LabManager]'''
+<br clear="all" />
+=== Equipment performance and process related parameters ===
+{| border="2" cellspacing="0" cellpadding="2"
+!style="background:silver; color:black;" align="center" width="60"|Purpose
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+*Spin coating and soft baking UV sensative resists
+*Spin coating E-beam resits
+|-
+!style="background:silver; color:black;" align="center" width="60"|Resist
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black" align="center"|
+* AZ5214E manual dispense
+* E-beam resits manual dispense
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
+|style="background:LightGrey; color:black"|Coating thickness
+|style="background:WhiteSmoke; color:black" align="center"|
+* AZ5214E 1-4,2 µm
+* E-beam resits 0,1-1 µm
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
+|style="background:LightGrey; color:black"|Spin speed
+|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+*Cover closed: 7000 rpm
+*Cover open: 1000 rpm
+* Gyrset: 3000 rpm
+* non-vaccum chuck: 5000 rpm
+|-
+|style="background:LightGrey; color:black"|Spin acceleration
+|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+- 5000 rpm/s
+|-
+|style="background:LightGrey; color:black"|Hotplate temperature
+|style="background:WhiteSmoke; color:black" align="center"|
+* 90° for III-V materials
+* 110° for III-V materials
+* changeable temperature from 20°-200° for other materials
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Substrate size
+|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+* 50 mm wafers
+* 100 mm wafers
+* 150 mm wafers
+* small pieces down to 3x3 mm2
+|-
+| style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+All cleanroom materials.
+Please notice that III-V materials need to be run on the dedicated chuck!
 |-
 |style="background:LightGrey; color:black"|Batch