Specific Process Knowledge/Lithography/NanoImprintLithography: Difference between revisions

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==EVG NIL==
==Imprinter 01==
[[Image:EVG NIL.jpg|300 × 300px|thumb|right|The EVG NIL is positioned in C-4]]
 


'''Feedback to this section''':  
'''Feedback to this section''':  
'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# EVG NIL click here]'''
'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''


The EVG NIL is a system for imprinting in polymers (Hot Embossing), and for bonding on wafer scale. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult.
The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).  


It is possible to fill bonded cavities with a desired gas. At the moment we have SF6 on the system, but if you would like another one, please contact Rune Christiansen.
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=391 LabManager]'''
 
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=153 LabManager]'''




<br clear="all" />
<br clear="all" />


==Process information==
====Types of Bonding====
*[[Specific Process Knowledge/Bonding/Eutectic bonding|Eutectic bonding]] 
*[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]]
*[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]]
====Imprint information====
*[[Specific Process Knowledge/Imprinting|Imprinting]]


<br clear="all" />
<br clear="all" />
==Overview of the performance of the EVG NIL and some process related parameters==
==Overview of the performance of the Imprinter 01 and some process related parameters==


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Imprint and bonding
|style="background:LightGrey; color:black"|  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Eutectic bonding
*Fusion bonding
*Anodic bonding
*Imprinting
*Imprinting
|-
|-
Line 40: Line 26:
|style="background:LightGrey; color:black"|Alignment accuracy
|style="background:LightGrey; color:black"|Alignment accuracy
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*&plusmn; 5 microns for IR alignment
*Only by eye
*&plusmn; 10 microns for backside alignment
 
|-
|-
|-
|-
Line 47: Line 33:
|style="background:LightGrey; color:black"|Process Temperature
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Room temperature to 500°C
*Room temperature to 200°C
|-
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*~5<math>\cdot</math>10<sup>-4</sup>mbar - 2000mbar
*~5<math>\cdot</math>1mbar - atm
|-
|-
|style="background:LightGrey; color:black"|Piston Force
|style="background:LightGrey; color:black"|Imprint Pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Depending on the area, for 4" wafers 200-20000N.
*0-6 bar
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*One 4" or 6" wafer per run
*Pieces to 4" wafers 
*Pieces are only allowed with speciel permission 
|-
|-
| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers
*Silicon
*Quartz wafers
*Quartz  
*Pyrex wafers
*Pyrex  
|-  
|-  
| style="background:LightGrey; color:black"|Material allowed on the substrate
| style="background:LightGrey; color:black"|Material allowed on the substrate

Revision as of 14:14, 18 May 2017

Imprinter 01

Feedback to this section: Imprinter 01 click here

The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

The user manual, user APV, and contact information can be found in LabManager





Overview of the performance of the Imprinter 01 and some process related parameters

Purpose
  • Imprinting
Performance Alignment accuracy
  • Only by eye
Process parameter range Process Temperature
  • Room temperature to 200°C
Process pressure
  • ~5Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle \cdot} 1mbar - atm
Imprint Pressure
  • 0-6 bar
Substrates Batch size
  • Pieces to 4" wafers
Substrate material allowed
  • Silicon
  • Quartz
  • Pyrex
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Poly Silicon
  • Photoresist
  • PMMA
  • TOPAS
  • SU-8
  • Metals: Au, Sn, Ag, Al, Ti.
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