Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater|Hummer]] | ! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Hummer_Sputter_coater|Hummer]] | ||
! Sputter coater Balzer | ! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Balzer_Sputter_coater|Balzer]] | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
Revision as of 11:29, 5 March 2014
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter (Lesker) | Sputter coater Hummer | Sputter coater Balzer | |
|---|---|---|---|---|---|
| Batch size |
|
|
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | ||
| Layer thickness | 10 Å to 5000Å* | 10 Å to 5000Å* | 10 Å to | ||
| Deposition rate | 2 Å/s to 10 Å/s | 1 Å/s to 10 Å/s | Not measured | Not measured |
* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings