Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

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@@ Line 27: / Line 27: @@
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
 |
-*Up to 1x4" wafers
+E-beam deposition of Aluminium
-*smaller pieces
 |
-*24x2" wafers or
+E-beam deposition of Aluminium
-*6x4" wafers or
-*6x6" wafers
 |
-*12x2" wafers or
+E-beam deposition of Aluminium
-*12x4" wafers or
-*4x6" wafers
 |
-*12x4" wafers or
+Sputter deposition of Aluminium
-*12x4" wafers or
-*4x6" wafers
 |
-*24x2" wafers or
+Sputter deposition of Aluminium
-*6x4" wafers or
-*6x6" wafers
 |
-*24x2" wafers or
+Aluminum deposition onto unexposed e-beam resist
-*6x4" wafers or
-*6x6" wafers
 |-
 |-style="background:LightGrey; color:black"
@@ Line 71: / Line 62: @@
 |10Å to 0.5 µm (this uses all Al in the boat)
 |-
 |-style="background:LightGrey; color:black"
 ! Deposition rate
@@ Line 80: / Line 72: @@
 |~2Å/s to 15Å/s
 |-
 |-style="background:WhiteSmoke; color:black"
-! Comment
+! Batch size
-|Thickness above 200 nm: ask for permission
+|
-|Thickness above 200 nm: ask for permission
+*Up to 1x4" wafers
-|Only very thin layers (up to 100 nm).
+*smaller pieces
-|Al sputter target: 99.995% Al
+|
-|&nbsp;
+*24x2" wafers or
-|Recommended for unexposed e-beam resist
+*6x4" wafers or
+*6x6" wafers
+|
+*12x2" wafers or
+*12x4" wafers or
+*4x6" wafers
+|
+*12x4" wafers or
+*12x4" wafers or
+*4x6" wafers
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
 |-style="background:LightGrey; color:black"
 ! Allowed substrates
@@ Line 120: / Line 132: @@
 * Quartz wafers
 * Pyrex wafers
@@ Line 180: / Line 193: @@
 * SU-8
 * Metals
+|-style="background:LightGrey; color:black"
+! Comment
+|Thickness above 200 nm: ask for permission
+|Thickness above 200 nm: ask for permission
+|Only very thin layers (up to 100 nm).
+|Al sputter target: 99.995% Al
+|&nbsp;
+|&nbsp;
 |}