Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions

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|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Ammonium sulfate
|98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub> (See [{{fnb|1}}] )
|98% Sulfuric acid and Hydrogen peroxide 4:1 add H<sub>2</sub>O<sub>2</sub> to H<sub>2</sub>SO<sub>4</sub> (See [[#fn_{{{1}}}_back|Note {{{1}}}]])
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Revision as of 14:23, 4 March 2014

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Cleaning of wafers or masks

Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fume hood in a beaker "Piranha". Both 7-up and Piranha removes heavy organics. Always use one of these after KOH etch or hot phosphoric acid etch to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions after stripping resist.

7-up 6" in cleanroom D3. <br\> -Up to 25 wafers of 4" or 6" at a time.<br\> -Materials allowed: Silicon, Poly Silicon, Silicon Oxide, Silicon Nitride, Silicon Oxynitride,Quartz/fused silica
7-up for masks and glass wafers positioned in cleanroom D3:<br\> -Up to 25 glass wafers of 4" at a time or 4 masks.<br\> -Materials allowed: Silicon, Poly Silicon, Silicon Oxide, Silicon Nitride, Silicon Oxynitride, Quartz/fused silica, glass (Pyrex and Soda Lime), chromium

The user manual, user APV and contact information can be found in LabManager: 7-up 6" info page in LabManager or 7-up (masks) info page in LabManager

The APV for working with piranha in fumehood can be found by clicking here

Comparing the 7-up cleans and Piranha clean

7-up wafers 7-up Masks Piranha
General description

Cleaning of wafers using the dedicated tank in cleanroom D3.

Cleaning of masks using the dedicated tank in cleanroom D3.

Cleaning of wafers using a beaker in the fumehood in cleanroom B1. Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers or masks.

Chemical solution 98% Sulfuric acid and Ammonium sulfate 98% Sulfuric acid and Ammonium sulfate 98% Sulfuric acid and Hydrogen peroxide 4:1 add H2O2 to H2SO4 (See [[#fn_{{{1}}}_back|Note {{{1}}}]]: )
Process temperature 80 oC 80 oC ~70 oC the chemicals will heat up to working temperature during mixing, therefore be careful! First ad H2SO4 then H2O21.
Process time 10 min. 10 min. 10 min.
Allowed materials
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Silicon
  • Poly Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Quartz/fused silica
  • Pyrex
  • Soda lime glass
  • Wafers with Cr

All materials (in beaker).

Batch size

1-25 4" or 6" wafers

1-25 4" or 6" wafers or 1-4 5" masks

1-5 4" wafer at a time

Size of substrate

4-6" wafers

4-6" wafers or 5" masks

All sizes that can fit into the beaker in a dedicated holder

Note 1: In preparing a solution involving an acid, always add the acid last. The exception to this rule is Piranha, in which case you add H2O2, which is a very strong base, to H2SO4, which is a very strong acid. This is done because it is potentially explosive and at the very least will cause the solution to become very warm.