Specific Process Knowledge/Characterization: Difference between revisions
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== Choose equipment == | == Choose equipment == | ||
*[[/SEM: Scanning Electron Microscopy |SEM FEI - ''This instrument has been relocated to CEN'']] | |||
*[[/SEM: Scanning Electron Microscopy |SEM FEI]] | |||
*[[/SEM: Scanning Electron Microscopy |SEM LEO]] | *[[/SEM: Scanning Electron Microscopy |SEM LEO]] | ||
*[[/SEM: Scanning Electron Microscopy |SEM JEOL]] | *[[/SEM: Scanning Electron Microscopy |SEM JEOL]] | ||
Revision as of 07:57, 30 April 2014
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Choose characterization topic
- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement
- Element analysis
- Contact angle measurement
- Four-Point_Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy