Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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*up to 1x6" wafer | *up to 1x6" wafer | ||
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*1x4" wafer | |||
*Several smaller samples | |||
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*1 large sample (< 4" wafer) | |||
*Several smaller samples | |||
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| Pre-clean | | Pre-clean | ||
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|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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| Layer thickness | | Layer thickness | ||
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|10 Å to 5000Å | |10 Å to 5000Å | ||
|10 Å to | |10 Å to | ||
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| Deposition rate | | Deposition rate | ||
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|1 Å/s to 15 Å/s | |1 Å/s to 15 Å/s | ||
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|Not measured | |||
|Not measured | |||
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Revision as of 15:02, 13 February 2014
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter (Lesker) | Sputter coater Hummer | Sputter coater Balzer | |
|---|---|---|---|---|---|
| Batch size |
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | ||
| Layer thickness | 10 Å to 5000Å | 10 Å to 5000Å | 10 Å to | ||
| Deposition rate | 2 Å/s to 15 Å/s | 1 Å/s to 15 Å/s | Not measured | Not measured |
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings