Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
No edit summary |
No edit summary |
||
| Line 24: | Line 24: | ||
| | | | ||
*up to 1x6" wafer | *up to 1x6" wafer | ||
| | |||
*1x4" wafer | |||
*Several smaller samples | |||
| | |||
*1 large sample (< 4" wafer) | |||
*Several smaller samples | |||
|- | |- | ||
| Pre-clean | | Pre-clean | ||
| Line 29: | Line 35: | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
| | |||
| | |||
|- | |- | ||
| Layer thickness | | Layer thickness | ||
| Line 34: | Line 42: | ||
|10 Å to 5000Å | |10 Å to 5000Å | ||
|10 Å to | |10 Å to | ||
| | |||
| | |||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
| Line 39: | Line 49: | ||
|1 Å/s to 15 Å/s | |1 Å/s to 15 Å/s | ||
| | | | ||
|Not measured | |||
|Not measured | |||
|- | |- | ||
|} | |} | ||