Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

Revision as of 15:06, 7 February 2014

Feedback to this page: click here

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

Equipment		Polisher/Lapper
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing)
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)
Substrates	Batch size	# small samples one 50 mm wafer one 100 mm wafer
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz

@@ Line 8: / Line 8: @@
 The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
-'''The user manual, user APV(s), technical information and contact information can be found in LabManager:'''
+'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
 <!-- remember to remove the type of documents that are not present -->