Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. | ||
'''The user manual(s) | '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | ||
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Revision as of 13:43, 7 February 2014
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TPT Wire Bonder
Packlab, Building 347, 2nd floor
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager:
Ball Wire Bonder K&S 4524
Packlab, Building 347, 2nd floor
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
| Equipment | TPT Wire Bonder | Ball Wire Bonder | |
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| Substrates | Allowed materials |
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