|
|
| Line 49: |
Line 49: |
| *[[/Wire Bonder|TPT Wire Bonder]] | | *[[/Wire Bonder|TPT Wire Bonder]] |
| *[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | | *[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] |
| |-
| |
| |}
| |
| == Choose material to be processed ==
| |
| {| {{table}}
| |
| | align="left" valign="top" style="background:LightGray"|''' Dielectrica'''
| |
| | align="left" valign="top" style="background:#DCDCDC;"|''' Semiconductors'''
| |
| | align="left" valign="top" style="background:LightGray"|''' Metals'''
| |
| | align="left" valign="top" style="background:LightGray"|''' Polymers'''
| |
| |-valign="top"
| |
| |style="background: LightGray"|
| |
| *[[/Borofloat back-end process|Borofloat glass (Pyrex)]]
| |
| *[[/Quartz back-end process|Fused silica (quartz)]]
| |
| |style="background: #DCDCDC"|
| |
| *[[/Silicon back-end process|Silicon]]
| |
| *[[/III-V lapping|III-V]]
| |
| |style="background: LightGray"|
| |
| *[[/Aluminium back-end process|Aluminium]]
| |
| *[[/Nickel back-end process|Nickel]]
| |
| *[[/Steel back-end process|Steel]]
| |
| |style="background: LightGray"|
| |
| *[[/PMMA back-end process|PMMA]]
| |
| *[[/TOPAS back-end process|TOPAS]]
| |
| *[[/Polystyrene back-end process|Polystyrene]]
| |
| *[[/Polycarbonate back-end process|Polycarbonate]]
| |
| |- | | |- |
| |} | | |} |
