Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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== Flip-chip bonder (glue attachment) == | == Flip-chip bonder (glue attachment) == | ||
The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between chip and substrate. With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of the camera unit, it is possible to align the contacts on the chip with the solder/glue dots on the contacts on the substrate before joining the two surfaces with a light pressure. The stack is cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate. | |||
[[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]] | [[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]] | ||