Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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[[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]] | [[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]] | ||
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:''' | |||
<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager] | ||