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| Line 160: |
Line 160: |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| |
| 1 - 25, multiple batches possible | | 1 - 25, multiple batches possible |
| |-
| |
| |}
| |
|
| |
| <br clear="all" />
| |
|
| |
| ==HMDS on Spin Track 1 + 2==
| |
|
| |
| [[image:SpinTrack.jpg|300x257px|right|thumb|Spin Track 1 + 2 in Cleanroom 3]]
| |
|
| |
| [[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Specific process knowledge on Spin Track 1 + 2]]
| |
|
| |
| ===Process information===
| |
|
| |
| [[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming|General process information about HMDS priming on Spin Track 1 + 2]]
| |
|
| |
| [[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|Standard HMDS process on Spin Track 1 and 2]]
| |
|
| |
| ===Equipment performance and process related parameters===
| |
|
| |
| {| border="2" cellspacing="0" cellpadding="2"
| |
|
| |
| !colspan="2" border="none" style="background:silver; color:black;" align="center"|Spin Track
| |
| |style="background:WhiteSmoke; color:black" align="center"|<b>1</b>
| |
| |style="background:WhiteSmoke; color:black" align="center"|<b>2</b>
| |
| |-
| |
| !style="background:silver; color:black;" align="center" width="60"|Purpose
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black"|
| |
| *HMDS priming
| |
| |style="background:WhiteSmoke; color:black"|
| |
| *HMDS priming
| |
| |-
| |
| !style="background:silver; color:black;" align="center" width="60"|Priming chemical
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| hexamethyldisilizane
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
| |
| |style="background:LightGrey; color:black"|HMDS contact angle
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 60° - 90°; standard recipe 82° (on SiO<sub>2</sub>)
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
| |
| |style="background:LightGrey; color:black"|HMDS priming temperature
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 50°C
| |
| |-
| |
| |style="background:LightGrey; color:black"|HMDS priming time
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 3 min / wafer
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
| |
| |style="background:LightGrey; color:black"|Substrate size
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 100 mm wafers
| |
| |-
| |
| | style="background:LightGrey; color:black"|Allowed materials
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| Silicon (with oxide, nitride, or metal films or patterning)
| |
|
| |
| Glass (borosilicate and quartz)
| |
| |-
| |
| |style="background:LightGrey; color:black"|Batch
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 1 - 25
| |
| |- | | |- |
| |} | | |} |
