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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

Taran (talk | contribs)
Taran (talk | contribs)
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|style="background:LightGrey; color:black"|Process time
|style="background:LightGrey; color:black"|Process time
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
32.5 min / batch
32.5 min
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
3 min / wafer
3 min / wafer
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|style="background:WhiteSmoke; color:black" align="center"|
100 mm wafers
100 mm wafers
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
All cleanroom materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon (with oxide, nitride, or metal films or patterning)
Silicon (with oxide, nitride, or metal films or patterning)


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|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
1 - 25, multiple batches possible
|style="background:WhiteSmoke; color:black" align="center"|
1 - 25
1 - 25
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