Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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'''Overview of HMDS prining at Danchip:''' | |||
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* HMDS priming only | * HMDS priming only | ||
* HMDS | * HMDS priming and spin coating | ||
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!style="background:silver; color:black;" align="center" width="60"|Priming chemical | !style="background:silver; color:black;" align="center" width="60"|Priming chemical | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Contact angle | ||
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standard recipe 82° (on SiO<sub>2</sub>) | |||
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60° - 90°; standard recipe 82° (on SiO<sub>2</sub>) | 60° - 90°; standard recipe 82° (on SiO<sub>2</sub>) | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Process temperature | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
50°C | 50°C | ||
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|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Process time | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
3 min / wafer | 3 min / wafer | ||