Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch): Difference between revisions

Revision as of 14:47, 3 February 2014 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,301 edits →Etching using the dry etch technique AOE (Advanced oxide etch) ← Older edit		Revision as of 14:48, 3 February 2014 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,301 edits →Etching using the dry etch technique AOE (Advanced oxide etch) Newer edit →
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	The AOE can be used for dry etching silicon oxide, silicon (oxy)nitride and quartz. Look in the manuals for the AOE to see how to operate the machine (you can find the manuals in LabManager on the AOE page).		The AOE can be used for dry etching silicon oxide, silicon (oxy)nitride and quartz. Look in the manuals for the AOE to see how to operate the machine (you can find the manuals in LabManager on the AOE page).


	'''The user manual, quality control procedure and results, user APV, technical information and contact information can be found in LabManager:'''		'''The user manual, quality control procedure and results, user APV, technical information and contact information can be found in LabManager:'''