Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b>
|style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b>
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> -->
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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*Metals
*Metals
*Glass/Quartz
*Glass/Quartz
|style="background:WhiteSmoke; color:black"|
<!-- |style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 1
*Purpose 2
*Purpose 2
*Purpose 3
*Purpose 3 -->
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
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*Thickness homogeneity: +/- 10 µm
*Thickness homogeneity: +/- 10 µm
*Roughness: +/- ? µm
*Roughness: +/- ? µm
|style="background:WhiteSmoke; color:black"|
<!-- |style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 1
*Performance range 2
*Performance range 2
*Performance range 3
*Performance range 3 -->
|-
|-
|style="background:LightGrey; color:black"|Polishing
|style="background:LightGrey; color:black"|Polishing
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*Thickness homogeneity: ? µm
*Thickness homogeneity: ? µm
*Roughness: +/- ? µm
*Roughness: +/- ? µm
|style="background:WhiteSmoke; color:black"|
<!-- |style="background:WhiteSmoke; color:black"|
*Performance range  
*Performance range -->
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
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*Al2O3 (alumina) powder: 3, 9 or 20 µm
*Al2O3 (alumina) powder: 3, 9 or 20 µm
*Chemlox (for polishing)
*Chemlox (for polishing)
|style="background:WhiteSmoke; color:black"|
*Range
|-
|-
|style="background:LightGrey; color:black"|Rotation speed
|style="background:LightGrey; color:black"|Rotation speed
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*Thinning: 5-20 rpm
*Thinning: 5-20 rpm
*Polishing: 5-80 rpm
*Polishing: 5-80 rpm
|style="background:WhiteSmoke; color:black"|
*Range
|-
|-
|style="background:LightGrey; color:black"|Arm sweep
|style="background:LightGrey; color:black"|Arm sweep
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*Thinning: stationary
*Thinning: stationary
*Polishing: 12% (inner) - 80% (outer)
*Polishing: 12% (inner) - 80% (outer)
|style="background:WhiteSmoke; color:black"|
*Range
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
|style="background:WhiteSmoke; color:black"|
<!-- |style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers  
*<nowiki>#</nowiki> 150 mm wafers -->
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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*Metals
*Metals
*Glass/Quartz
*Glass/Quartz
|style="background:WhiteSmoke; color:black"|
<!-- |style="background:WhiteSmoke; color:black"|
*Allowed material 1  
*Allowed material 1  
*Allowed material 2
*Allowed material 2
*Allowed material 3
*Allowed material 3 -->
|-  
|-  
|}
|}


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Revision as of 14:46, 3 February 2014

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Polisher/Lapper

The Logitech PM5 Polisher/Lapper

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV(s), technical information and contact information can be found in LabManager:

The Logitech PM5 Polisher/Lapper in LabManager

Equipment performance and process related parameters

Equipment Polisher/Lapper
Purpose

Thinning of substrates of

  • InP
  • GaAs
  • Silicon
  • Metals
  • Glass/Quartz
Performance Thinning
  • Removal rate: 1-10µm/min
  • Thickness accuracy: +/- 10 µm
  • Thickness homogeneity: +/- 10 µm
  • Roughness: +/- ? µm
Polishing
  • Removal rate: ~1 µm/min
  • Thickness accuracy: ? µm
  • Thickness homogeneity: ? µm
  • Roughness: +/- ? µm
Process parameter range Polishing liquid
  • Al2O3 (alumina) powder: 3, 9 or 20 µm
  • Chemlox (for polishing)
Rotation speed
  • Thinning: 5-20 rpm
  • Polishing: 5-80 rpm
Arm sweep
  • Thinning: stationary
  • Polishing: 12% (inner) - 80% (outer)
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
Allowed materials
  • InP
  • GaAs
  • Silicon
  • Metals
  • Glass/Quartz


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