Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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Polisher/Lapper

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV(s), technical information and contact information can be found in LabManager:

The Logitech PM5 Polisher/Lapper in LabManager

Equipment performance and process related parameters

Equipment		Polisher/Lapper	Equipment 2
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz	Purpose 1 Purpose 2 Purpose 3
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm	Performance range 1 Performance range 2 Performance range 3
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm	Performance range
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing)	Range
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm	Range
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz	Allowed material 1 Allowed material 2 Allowed material 3

@@ Line 19: / Line 19: @@
 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
+|style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b>
 |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
 |-
 !style="background:silver; color:black;" align="center" width="60"|Purpose
 |style="background:LightGrey; color:black"|
+Thinning of substrates of
 |style="background:WhiteSmoke; color:black"|
-*Purpose 1
+*InP
-*Purpose 2
+*GaAs
+*Silicon
+*Metals
+*Glass/Quartz
 |style="background:WhiteSmoke; color:black"|
 *Purpose 1
@@ Line 33: / Line 37: @@
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
-|style="background:LightGrey; color:black"|Response 1
+|style="background:LightGrey; color:black"| Thinning
 |style="background:WhiteSmoke; color:black"|
-*Performance range 1
+*Removal rate: 1-10µm/min
-*Performance range 2
+*Thickness accuracy: +/- 10 µm
+*Thickness homogeneity: +/- 10 µm
+*Roughness: +/- ? µm
 |style="background:WhiteSmoke; color:black"|
 *Performance range 1
@@ Line 42: / Line 48: @@
 *Performance range 3
 |-
-|style="background:LightGrey; color:black"|Response 2
+|style="background:LightGrey; color:black"|Polishing
 |style="background:WhiteSmoke; color:black"|
-*Performance range
+*Removal rate: ~1 µm/min
+*Thickness accuracy: ? µm
+*Thickness homogeneity: ? µm
+*Roughness: +/- ? µm
 |style="background:WhiteSmoke; color:black"|
 *Performance range
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
-|style="background:LightGrey; color:black"|Parameter 1
+|style="background:LightGrey; color:black"|Polishing liquid
 |style="background:WhiteSmoke; color:black"|
-*Range
+*Al2O3 (alumina) powder: 3, 9 or 20 µm
+*Chemlox (for polishing)
 |style="background:WhiteSmoke; color:black"|
 *Range
 |-
-|style="background:LightGrey; color:black"|Parameter 2
+|style="background:LightGrey; color:black"|Rotation speed
+|style="background:WhiteSmoke; color:black"|
+*Thinning: 5-20 rpm
+*Polishing: 5-80 rpm
 |style="background:WhiteSmoke; color:black"|
 *Range
+|-
+|style="background:LightGrey; color:black"|Arm sweep
+|style="background:WhiteSmoke; color:black"|
+*Thinning: stationary
+*Polishing: 12% (inner) - 80% (outer)
 |style="background:WhiteSmoke; color:black"|
 *Range
@@ Line 67: / Line 85: @@
 *<nowiki>#</nowiki> 50 mm wafers
 *<nowiki>#</nowiki> 100 mm wafers
-*<nowiki>#</nowiki> 150 mm wafers
 |style="background:WhiteSmoke; color:black"|
 *<nowiki>#</nowiki> small samples
@@ Line 76: / Line 93: @@
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
-*Allowed material 1
+*InP
-*Allowed material 2
+*GaAs
+*Silicon
+*Metals
+*Glass/Quartz
 |style="background:WhiteSmoke; color:black"|
 *Allowed material 1