Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
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==Etching of Titanium== | ==Etching of Titanium== | ||
Etching of Titatium is done wet at Danchip. We have ?: | Etching of Titatium is done wet at Danchip making your own set up in a beaker in a fumehood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fumehood in cleanroom 2. We have ?: | ||
# | # BHF | ||
# | # | ||
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{| border="1" cellspacing="0" cellpadding="4" align="left" | {| border="1" cellspacing="0" cellpadding="4" align="left" | ||
! | ! | ||
! | ! BHF | ||
! | ! | ||
|- | |- | ||
|General description | |General description | ||
| | | | ||
Etch of | Etch of titanium with or without photoresist mask. | ||
| | | | ||
Etch of | Etch of | ||
|- | |- | ||
|Chemical solution | |Chemical solution | ||
| | |HF:NH<math>_4</math>F | ||
| | |. | ||
|- | |- | ||
|Process temperature | |Process temperature | ||
| | |Room temperature | ||
| | | | ||
|- | |- | ||
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Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) | ||
| | | | ||
. | |||
|- | |- | ||
|Etch rate | |Etch rate | ||
| | | | ||
? | |||
| | | | ||
? | |||
|- | |- | ||
|Batch size | |Batch size | ||
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|Allowed materials | |Allowed materials | ||
| | | | ||
No restrictions when used in beaker or PP-etch bath in the fumehood in cleanroom 2. | |||
| | | | ||
*Aluminium | *Aluminium |
Revision as of 09:53, 31 January 2008
Etching of Titanium
Etching of Titatium is done wet at Danchip making your own set up in a beaker in a fumehood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fumehood in cleanroom 2. We have ?:
- BHF
Comparing the two solutions
BHF | ||
---|---|---|
General description |
Etch of titanium with or without photoresist mask. |
Etch of |
Chemical solution | HF:NHF | . |
Process temperature | Room temperature | |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
. |
Etch rate |
? |
? |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
4" wafers |
4" wafers |
Allowed materials |
No restrictions when used in beaker or PP-etch bath in the fumehood in cleanroom 2. |
|