Specific Process Knowledge/Characterization: Difference between revisions
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*[[/SEM: Scanning Electron Microscopy|SEM FEI]] | *[[/SEM: Scanning Electron Microscopy/FEI |SEM FEI]] | ||
*[[/SEM: Scanning Electron Microscopy|SEM LEO]] | *[[/SEM: Scanning Electron Microscopy/Leo |SEM LEO]] | ||
*[[/SEM: Scanning Electron Microscopy|SEM JEOL]] | *[[/SEM: Scanning Electron Microscopy/Jeol |SEM JEOL]] | ||
*[[/SEM: Scanning Electron Microscopy|SEM Zeiss]] | *[[/SEM: Scanning Electron Microscopy/Zeiss |SEM Zeiss]] | ||
*[[/SEM: Scanning Electron Microscopy|SEM Zeiss Supra 60 VP]] | *[[/SEM: Scanning Electron Microscopy/supra60VP| SEM Zeiss Supra 60 VP]] | ||
*[[/AFM: Atomic Force Microscopy|Nanoman - ''Atomic Force Microscopy'']] | *[[/AFM: Atomic Force Microscopy|Nanoman - ''Atomic Force Microscopy'']] | ||
Revision as of 13:23, 29 January 2014
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Choose characterization topic
- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement
- Element analysis
- Contact angle measurement
- Resistivity measurement
- Scanning Electron Microscopy