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Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions

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NickelVanadium can be deposited by sputter evaporation. In the chart below you can compare the different deposition equipment.
Nickel Vanadium can be deposited by sputter evaporation. In the chart below you can compare the different deposition equipment.




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! Comment
! Comment


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| Sputter target with NiV composition: Ni/V 93/7%
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| Sputter target with NiV composition: Ni/V 93/7%
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"

Revision as of 15:08, 28 January 2014

Nickel Vanadium can be deposited by sputter evaporation. In the chart below you can compare the different deposition equipment.


Sputter deposition (PVD co-sputter/evaporation) Sputter deposition (Sputter-System Lesker)
Batch size
  • 12x2" wafers or
  • 12x4" wafers or
  • 4x6" wafers
  • 1x4" wafer or
  • 1x6" wafer
Pre-clean RF Ar clean
Layer thickness About 10Å to 4000Å .
Deposition rate Depending on process parameters. Depending on process parameters.
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Silicon wafers
Comment Sputter target with NiV composition: Ni/V 93/7% Sputter target with NiV composition: Ni/V 93/7%
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