Specific Process Knowledge/Thin film deposition/PECVD: Difference between revisions
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*III-V wafes (on special carriers) | *III-V wafes (on special carriers) | ||
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*Silicon wafers | *Silicon wafers, Quarts (fused silica) wafers | ||
**with layers of silicon oxide or silicon (oxy)nitride | **with layers of silicon oxide or silicon (oxy)nitride | ||
* | *Other material can be allowed if less than 3.9 cm2 is exposed to the plasma, please ask! | ||
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| style="background:LightGrey; color:black"|Material allowed on the substrate | | style="background:LightGrey; color:black"|Material allowed on the substrate | ||