Specific Process Knowledge/Thin film deposition/Deposition of Nickel

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Nickel deposition

Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

• Electroplating of nickel

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	E-beam evaporation (PVD co-sputter/evaporation)	Electroplating (Electroplating-Ni)
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	12x2" wafers or 12x4" wafers or 4x6" wafers	1x2" wafer or 1x4" wafer or 1x6" wafer
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean	None
Layer thickness	10Å to 5000 Å	10Å to 1 µm	10Å to 1000 Å	A few µm to 1400 µm
Deposition rate	2Å/s to 15Å/s	10Å/s to 15Å/s	About 1Å/s	About 10 to 250 Å/s
Comment		Stress in Wordentec Ni films: study here.	Only very thin layers (up to 100nm).	Sample must be compatible with plating bath. Seed metal necessary.