Specific Process Knowledge/Back-end processing: Difference between revisions
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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | ||
These processes are usually carried out outside the clean room. | These processes are usually carried out outside the clean room. At Danchip we have a laboratory called Packlab located in building 347 1.st floor. It is a class 1000 clean room | ||
== Choose an equipment == | == Choose an equipment == | ||