Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | '''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | ||
==Quality Control - Recipe Parameters and Limits== | ==Quality Control - Recipe Parameters and Limits== | ||
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*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br> | *[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br> | ||
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==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
Revision as of 08:26, 17 January 2014
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Thickness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
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The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
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Purpose |
Thickness measurer |
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|---|---|---|
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Performance |
Thickness resolution |
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Substrates |
Batch size |
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| Substrate materials allowed |
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