Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

Revision as of 08:26, 17 January 2014

Feedback to this page: click here

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.

The user manual, technical information and contact information can be found in LabManager:

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.

Purpose	Thickness measurer	Wafer thickness Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	< 5 µm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	No restrictions

Revision as of 11:20, 15 January 2014 view source Pevo (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 2,009 edits No edit summary ← Older edit		Revision as of 08:26, 17 January 2014 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,018 edits →‎Thickness measurer Newer edit →
Line 7:		Line 7:

	During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.		During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.


	'''The user manual, technical information and contact information can be found in LabManager:'''		'''The user manual, technical information and contact information can be found in LabManager:'''