Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||
Doing a KOH etch can it be helpful to | Doing a KOH etch can it be helpful to ensure no over-etching by making a thickness measurement during the etching. | ||
'''The user manual, technical information and contact information can be found in LabManager:''' | '''The user manual, technical information and contact information can be found in LabManager:''' | ||