Specific Process Knowledge/Characterization/Profiler: Difference between revisions
| Line 155: | Line 155: | ||
*Step height measurements | *Step height measurements | ||
*3D topographic measurements | *3D topographic measurements | ||
*Thick and thin film thickness measurements in small spots (down to | *Thick and thin film thickness measurements in small spots (down to 4 µm) | ||
|- | |- | ||
!style="background:silver; color:black;" align="left"|Posibilities | !style="background:silver; color:black;" align="left"|Posibilities | ||
| Line 165: | Line 165: | ||
*VSI (Vertical Scanning Interferometry) | *VSI (Vertical Scanning Interferometry) | ||
*High resolution thin film thickness measurement using reflectrometry | *High resolution thin film thickness measurement using reflectrometry | ||
*Stitched scans | |||
*Wafer mapping | *Wafer mapping | ||
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|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *Substrates bigger than 150 mm wafers | ||
|- | |- | ||
|style="background:silver; color:black"| | |style="background:silver; color:black"| | ||
| style="background:LightGrey; color:black"|Substrate | | style="background:LightGrey; color:black"|Substrate materials allowed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*In principle all materials | *In principle all materials | ||