Specific Process Knowledge/Characterization/Profiler: Difference between revisions
| Line 128: | Line 128: | ||
The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution. | The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution. | ||
For most samples the optical profiler provides fast and easy information without any sample preparation. | For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary cover thin transparant layers (< 2 µm) with a thin layer a metal. | ||
The resolution is limited by the objectives and wavelenght of the light. Also the depth of focus is limited, especially for higher magnifications. | The resolution is limited by the objectives and wavelenght of the light. Also the depth of focus is limited, especially for higher magnifications. | ||