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Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>


{| {{table}}
The measured standard is 0.1 mm. The measured result have to be within +- 0.005 mm. The QC is preformed ones a year.
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:200px"
 
! QC Recipe:
! Wet1050
! Dry1050
|-  
| H<sub>2</sub> flow
|3 sccm
|0 sccm
|-
|O<sub>2</sub> flow
|2 sccm
|5 sccm
|-
|Temperature
|1050 C
|1050 C
|-
|Oxidation time
|30 min
|100 min
|-
|}
 
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:500px"
!QC limits
|Thickness
|Non-uniformity (both over a single wafer
and over the boat)
|-
!Dry1050
|110-116 nm
|3 %
|-
!Wet1050
|305-321 nm
|5 %
|-
|}
|-
|}
|}
 


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization/Thickness_Measurer"