Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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| 20 µm | | 20 µm | ||
| [[media:TB_1064nm_255mm_cutting_pyrex_microfluidic_hole.xls|Cutting Pyrex 1000µm for microfluidic hole parameters]] | | [[media:TB_1064nm_255mm_cutting_pyrex_microfluidic_hole.xls|Cutting Pyrex 1000µm for microfluidic hole parameters]] | ||
| Increase/decrease the number of iteration to increase/decrease the width of the hole. [[ | | Increase/decrease the number of iteration to increase/decrease the width of the hole. [[media:pyrex_10um_hole_chanel.jpg|Microscope view of the chanel ]] | ||
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