Specific Process Knowledge/Thermal Process/A1 Bor Drive-in furnace

Feedback to this page: click here

Boron Drive-in + Pre-dep furnace (A1)

Boron Drive-in + Pre-dep furnace (A1). Positioned in cleanroom B-1

The Boron Drive-in + Pre-dep furnace (A1) is a Tempress horizontal furnace for oxidation of silicon wafers, annealing of the grown oxide, drive-in of boron after a pre-deposition and oxidation of the boron phase layer. Boron pre-deposition takes place in the same furnace. The Boron Drive-in furnace can also be used to drive-in p-doped wafers which has been ion implanted.

For the pre-deposition process boron source wafers are used as the doping source to dope Si wafers with boron to make conductive structures, etch stop layers etc. There are only a few source wafers, i.e. it is not possible to make an entire batch of 30 wafers, but both sides of the doping source wafers are available for pre-deposition. It is necessary to activate the source wafers before use by heating them for 1 hour at the temperature needed during the pre-deposition (but not lover than 1050 degrees Celsius). During the pre-deposition a boron phase layer is created on the device wafers. This layer can be removed in HF if the wafers are oxidised in the furnace after the pre-deposition.

The Boron Drive-in + Pre-dep furnace is the top furnace tube in the A-stack positioned in cleanroom 2. The furnaces in the A-stack are the cleanest of all furnaces in the cleanroom. Please be aware of that all wafers have to be RCA cleaned before they enter the furnace, and check the cross contamination information in LabManager before you use the furnace.

The user manual, quality control instruction and results, technical information and contact information can be found in LabManager:

Boron Drive-in + Pre-dep furnace (A1)

Process knowledge

• Boron drive-in: look at the Dope with Boron page
• Oxidation: look at the Oxidation page
• Annealing: look at the Annealing page
• Boron doping: look at the Dope with Boron page.

Quality Control - Parameters and Limits

Quality control (QC) for the processes "Wet1050" and "Dry1050"

The QC procedure for the Boron Drive-in + Pre-dep furnace (A1) The newest QC data for wet and dry oxide QC Recipe: Wet1050 Dry1050 H2 flow 3 sccm 0 sccm O2 flow 2 sccm 5 sccm Temperature 1050 C 1050 C Oxidation time 30 min 100 min QC limits Thickness Non-uniformity (both over a single wafer and over the boat) Dry1050 108-114 nm 3 % Wet1050 286-302 nm 5 %

Overview of the performance of the Boron Drive-in + Pre-dep furnace and some process related parameters

Purpose	Drive-in of boron Oxidation of silicon Oxidation of boron phase layers Annealing of the oxide Boron pre-depostion using source wafer	Oxidation: Dry Wet: with torch (H2+O2)
Performance	Film thickness	Dry oxide: 50 Å to ~2000 Å (it takes too long to grow a thicker oxide) Wet oxide: 50 Å to ~3 µm (it takes too long to grow a thicker oxide)
Process parameter range	Process Temperature	800-1150 oC
	Process pressure	1 atm
	Gasses on the system	O2, N2 and H2
Substrates	Batch size	1-30 100 mm wafers (or 50 mm wafers) per run
	Substrate materials allowed	Silicon wafers (RCA cleaned)