Specific Process Knowledge/Characterization/Drop Shape Analyzer: Difference between revisions
| Line 4: | Line 4: | ||
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]= | =<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]= | ||
= The Drop Shape Analyzer = | == The Drop Shape Analyzer == | ||
Krüss DSA100 for measurements of contact angles and surface free energy. | |||
The Krüss DSA 100S Drop Shape Analyzer will analyze the shapes of drops of liquid on a surface or suspended from a needle in order to calculate the contact angle or the surface tension, respectively. | |||
'''The user manual, user APV(s), technical information, and contact information can be found in LabManager:''' | |||
<!-- remember to remove the type of documents that are not present --> | |||
[[image:DropShapeAnalyzer.jpg|200x200px|right|thumb|The Krüss DSA 100s Drop Shape Analyzer]] | [[image:DropShapeAnalyzer.jpg|200x200px|right|thumb|The Krüss DSA 100s Drop Shape Analyzer]] | ||
<!-- give the link to the equipment info page in LabManager: --> | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=169 Drop Shape Analyzer in LabManager] | |||
== Process information == | |||
Link to process pages - e.g. one page for each material | |||
Example: | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]] | |||
==Equipment performance and process related parameters== | |||