Specific Process Knowledge/Characterization/Drop Shape Analyzer: Difference between revisions
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= The Drop Shape Analyzer = | == The Drop Shape Analyzer == | ||
Krüss DSA100 for measurements of contact angles and surface free energy. | |||
The Krüss DSA 100S Drop Shape Analyzer will analyze the shapes of drops of liquid on a surface or suspended from a needle in order to calculate the contact angle or the surface tension, respectively. | |||
'''The user manual, user APV(s), technical information, and contact information can be found in LabManager:''' | |||
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[[image:DropShapeAnalyzer.jpg|200x200px|right|thumb|The Krüss DSA 100s Drop Shape Analyzer]] | [[image:DropShapeAnalyzer.jpg|200x200px|right|thumb|The Krüss DSA 100s Drop Shape Analyzer]] | ||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=169 Drop Shape Analyzer in LabManager] | |||
== Process information == | |||
Link to process pages - e.g. one page for each material | |||
Example: | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]] | |||
==Equipment performance and process related parameters== |
Revision as of 13:18, 10 January 2014
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The Drop Shape Analyzer
Krüss DSA100 for measurements of contact angles and surface free energy.
The Krüss DSA 100S Drop Shape Analyzer will analyze the shapes of drops of liquid on a surface or suspended from a needle in order to calculate the contact angle or the surface tension, respectively.
The user manual, user APV(s), technical information, and contact information can be found in LabManager:
Drop Shape Analyzer in LabManager
Process information
Link to process pages - e.g. one page for each material
Example:
- Etch of silicon using RIE
- Etch of silicon oxide using RIE
- Etch of silicon nitride using RIE
- Etch of photo resist using RIE