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==Wordentec QCL 800==
==Wordentec QCL 800==
[[Image:Wordentec.jpg|300x300px|thumb|Wordendec: positioned in cleanroom 4 in the Wordentec room]]
[[Image:Wordentec.jpg|300x300px|thumb|Wordendec: positioned in cleanroom D-2 in the Wordentec room]]


The Wordentec is a machine for:
The Wordentec is a machine for:
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Adaptors exist for deposition on 2", 4" and 6" wafers, but deposition is possible on samples of almost any size and shape, as long as they do not exceed the size of a 6" substrate.  
Adaptors exist for deposition on 2", 4" and 6" wafers, but deposition is possible on samples of almost any size and shape, as long as they do not exceed the size of a 6" substrate.  
The Wordentec supports either single sample deposition on each sample or batch deposition on six wafers in sequence. It is possible to freely combine processes from the machines different sources.
The Wordentec supports either single sample deposition on each sample or batch deposition on six wafers in sequence. It is possible to freely combine processes from the machines different sources.
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=167  Wordentec in LabManager]


==Process information==
==Process information==
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More information about deposition rates and surface roughness can be found by clicking on the different elements.
More information about deposition rates and surface roughness can be found by clicking on the different elements.


== Overview of the performance of Wordentec and some process related parameters==
==Equipment performance and and process related parameters Wordentec==


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