Specific Process Knowledge/Etch/Etching of Silicon/Si etch using ASE: Difference between revisions
| Line 81: | Line 81: | ||
|- | |- | ||
|Etch rate in Si | |Etch rate in Si | ||
| | |3 - 4 µm/min | ||
|- | |- | ||
|Non-uniformity | |Non-uniformity | ||
| | | 5 % | ||
|- | |- | ||
|} | |} | ||
| Line 150: | Line 150: | ||
|- | |- | ||
|Etch rate in Si | |Etch rate in Si | ||
| | | 4 - 6 µm/min | ||
|- | |- | ||
|Non-uniformity | |Non-uniformity | ||
| | | 5 % | ||
|- | |- | ||
|} | |} | ||
| Line 160: | Line 160: | ||
|} | |} | ||
== Recipes on the ASE == | == Recipes on the ASE == | ||