Specific Process Knowledge/Etch/Etching of Silicon/Si etch using ASE: Difference between revisions
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The shallolr recipe is designed to etch features (with sizes above 1 µm) in silicon down to a depth that ranges from a few microns to some 50 microns. (If you need to etch deeper use Deepetch or more shallow, see Nanoetches.) It is specified to etch a 2 µm wide trench down to a depth of 20 µm on a wafer that has a global/local etch opening density of 10%. | The shallolr recipe is designed to etch features (with sizes above 1 µm) in silicon down to a depth that ranges from a few microns to some 50 microns. (If you need to etch deeper use Deepetch or more shallow, see Nanoetches.) It is specified to etch a 2 µm wide trench down to a depth of 20 µm on a wafer that has a global/local etch opening density of 10%. | ||
The recipe is given | The recipe is given above. | ||
The process runs for 31 cycles (5:56 mins). The fact that it's Bosch process is clear from the scallops on the sidewalls - one should be able to count 31 of them. | The process runs for 31 cycles (5:56 mins). The fact that it's Bosch process is clear from the scallops on the sidewalls - one should be able to count 31 of them. | ||