Specific Process Knowledge/Etch/Etching of Silicon/Si etch using ASE: Difference between revisions
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== Quality control procedure on the ASE== | == Quality control procedure on the ASE== | ||
Two recipes have been optimized for the ASE. Their specification is on a 10 % etch load wafer with trenches. | |||
* '''Shallolr''': The shallow etch process will etch a 2 µm opening down to make a 20 µm trench. | |||
* '''Deepetch''': The deep etch process will etch a 50 µm opening down to make a 300 µm trench. | |||
The standardization procedure on the ASE covers these two etches. | |||
{| border="1" cellspacing="2" cellpadding="2" colspan="3" | {| border="1" cellspacing="2" cellpadding="2" colspan="3" | ||
|bgcolor="#98FB98" |'''Quality Control (QC) for ASE''' | |bgcolor="#98FB98" |'''Quality Control (QC) for ASE''' | ||