Specific Process Knowledge/Back-end processing: Difference between revisions

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| align="left" valign="top" style="background:#DCDCDC;"|''' Semiconductors'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Semiconductors'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:LightGray"|''' Plastics'''
| align="left" valign="top" style="background:LightGray"|''' Polymers'''
|-valign="top"
|-valign="top"
|style="background: LightGray"|
|style="background: LightGray"|

Revision as of 14:58, 6 December 2013

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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out outside the clean room.

Choose an equipment

Choose material to be processed

Dielectrica Semiconductors Metals Polymers
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