Specific Process Knowledge/Back-end processing: Difference between revisions
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* X-ray inspection system | * X-ray inspection system | ||
**[[/Focal Spot X-ray system|Focal Spot X-ray system]] | **[[/Focal Spot X-ray system|Focal Spot X-ray system]] | ||
== Choose material to be processed == | |||
{| {{table}} | |||
| align="left" valign="top" style="background:LightGray"|''' Dielectrica''' | |||
| align="left" valign="top" style="background:#DCDCDC;"|''' Semiconductors''' | |||
| align="left" valign="top" style="background:LightGray"|''' Metals''' | |||
| align="left" valign="top" style="background:LightGray"|''' Plastics''' | |||
|-valign="top" | |||
|style="background: LightGray"| | |||
*[[/Borofloat cutting and milling|Borofloat glass (Pyrex)]] | |||
*[[/Quartz cutting and milling|Fused silica (quartz)]] | |||
|style="background: #DCDCDC"| | |||
*[[/Silicon cutting and milling|Silicon]] | |||
*[[/III-V lapping|III-V]] | |||
|style="background: LightGray"| | |||
*[[/Aluminium cutting and milling|Aluminium]] | |||
*[[/Nickel cutting and milling|Nickel]] | |||
*[[/Steel cutting and milling|Steel]] | |||
|style="background: LightGray"| | |||
*[[/PMMA cutting and milling|PMMA]] | |||
*[[/TOPAS cutting and milling|TOPAS]] | |||
*[[/Polystyrene cutting and milling|Polystyrene]] | |||
*[[/Polycarbonate cutting and milling|Polycarbonate]] | |||
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