Specific Process Knowledge/Back-end processing: Difference between revisions

Revision as of 14:56, 6 December 2013

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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out outside the clean room.

Choose an equipment

Chip/die mounting
- Die Bonder (eutectic metal)
- Flip-chip Bonder (glue)
Wire bonding
- TPT Wire Bonder
- Ball Wire Bonder
Wafer dicing/machining
Molding
- Polymer Injection Molder
X-ray inspection system
- Focal Spot X-ray system

Choose material to be processed

Dielectrica	Semiconductors	Metals	Plastics
Borofloat glass (Pyrex) Fused silica (quartz)	Silicon III-V	Aluminium Nickel Steel	PMMA TOPAS Polystyrene Polycarbonate

@@ Line 23: / Line 23: @@
 * X-ray inspection system
 **[[/Focal Spot X-ray system|Focal Spot X-ray system]]
+== Choose material to be processed ==
+{| {{table}}
+| align="left" valign="top"  style="background:LightGray"|''' Dielectrica'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Semiconductors'''
+| align="left" valign="top" style="background:LightGray"|''' Metals'''
+| align="left" valign="top" style="background:LightGray"|''' Plastics'''
+|-valign="top"
+|style="background: LightGray"|
+*[[/Borofloat cutting and milling|Borofloat glass (Pyrex)]]
+*[[/Quartz cutting and milling|Fused silica (quartz)]]
+|style="background: #DCDCDC"|
+*[[/Silicon cutting and milling|Silicon]]
+*[[/III-V lapping|III-V]]
+|style="background: LightGray"|
+*[[/Aluminium cutting and milling|Aluminium]]
+*[[/Nickel cutting and milling|Nickel]]
+*[[/Steel cutting and milling|Steel]]
+|style="background: LightGray"|
+*[[/PMMA cutting and milling|PMMA]]
+*[[/TOPAS cutting and milling|TOPAS]]
+*[[/Polystyrene cutting and milling|Polystyrene]]
+*[[/Polycarbonate cutting and milling|Polycarbonate]]
+|-
+|}