Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions
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| From Predep furnace directly (e.g. incl. Predep HF*)||From A1||From A4||x||.||x||.||x | | From Predep furnace directly (e.g. incl. Predep HF*)||From A1||From A4||x||.||x||.||x | ||
|- | |- | ||
| Wafers directly from | | Wafers directly from PECVD2||.||.||x||.||x||.||x | ||
|- | |- | ||
| Wafers directly from NIL bonding||.||.||.||.||x||.||x | | Wafers directly from NIL bonding||.||.||.||.||x||.||x | ||