Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
| Line 70: | Line 70: | ||
!KOH 2&3 | !KOH 2&3 | ||
|- | |- | ||
|Etch rate in Si | |Etch rate in Si(100) | ||
|1.3 ± 0.1 µm/min | |1.3 ± 0.1 µm/min | ||
|1.29 ± 0.06 µm/min | |1.29 ± 0.06 µm/min | ||
| Line 70: | Line 70: | ||
!KOH 2&3 | !KOH 2&3 | ||
|- | |- | ||
|Etch rate in Si | |Etch rate in Si(100) | ||
|1.3 ± 0.1 µm/min | |1.3 ± 0.1 µm/min | ||
|1.29 ± 0.06 µm/min | |1.29 ± 0.06 µm/min | ||