Specific Process Knowledge/Lithography/NanoImprintLithography: Difference between revisions
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'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# EVG NIL click here]''' | '''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# EVG NIL click here]''' | ||
The EVG NIL is a system for imprinting in polymers (Hot Embossing), and for bonding on wafer scale. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult. | |||
It is possible to fill bonded cavities with a desired gas. At the moment we have SF6 on the system, but if you would like another one, please contact Rune Christiansen. | |||
Revision as of 11:45, 25 November 2013
EVG NIL
Feedback to this section: EVG NIL click here
The EVG NIL is a system for imprinting in polymers (Hot Embossing), and for bonding on wafer scale. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult.
It is possible to fill bonded cavities with a desired gas. At the moment we have SF6 on the system, but if you would like another one, please contact Rune Christiansen.
The user manual, user APV, and contact information can be found in LabManager