Specific Process Knowledge/Etch/Etching of TOPAS: Difference between revisions
| Line 62: | Line 62: | ||
|Etch | |Etch | ||
*O<sub>2</sub> flow [sccm]:50 | *O<sub>2</sub> flow [sccm]:50 | ||
* | *CO<sub>2</sub> flow [sccm]:50 | ||
*Pressure [mTorr]:40 | *Pressure [mTorr]:40 | ||
*Coil power [W]:800 | *Coil power [W]:800 | ||