Specific Process Knowledge/Etch: Difference between revisions
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== Choose material to be etched == | == Choose material to be etched == | ||
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| align="left" valign="top" style="background:LightGray"|''' Dielectrica''' | |||
| align="left" valign="top" style="background:#DCDCDC;"|''' Semicondutors''' | |||
| align="left" valign="top" style="background:LightGray"|''' Metals''' | |||
| align="left" valign="top" style="background:#DCDCDC;"|''' Alloys''' | |||
| align="left" valign="top" style="background:LightGray"|''' Polymers''' | |||
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*[[/Etching of Silicon Nitride|Silicon Nitride]] | |||
*[[/Etching of Silicon Oxide|Silicon Oxide]] | |||
*[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | |||
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*[[/Etching of Silicon|Silicon]] | |||
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*[[/Etching of Aluminium|Aluminium]] | *[[/Etching of Aluminium|Aluminium]] | ||
*[[/Etching of Chromium|Chromium]] | *[[/Etching of Chromium|Chromium]] | ||
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*[[/Etching of Platinum|Platinum]] | *[[/Etching of Platinum|Platinum]] | ||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe'' | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe'' | ||
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*No results, use IBE | |||
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*[[/Etching of Polymer|Polymer]] | *[[/Etching of Polymer|Polymer]] | ||
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== Choose Method == | == Choose Method/Equipment for the Etch == | ||
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*[[/Wet Gold Etch|Wet Gold Etch]] | *[[/Wet Gold Etch|Wet Gold Etch]] | ||
*[[/Wet Platinum Etch|Wet Platinum Etch]] | *[[/Wet Platinum Etch|Wet Platinum Etch]] | ||
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