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| *[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | | *[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' |
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| == Choose a dry etch equipment == | | == Choose Method == |
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| *[[/RIE (Reactive Ion Etch)|RIE (Reactive Ion Etch)]]
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| *[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]]
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| *[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]]
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| *[[/DRIE-Pegasus|DRIE-Pegasus (Silicon Etch)]]
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| *[[/ICP Metal Etcher|ICP Metal Etch]]
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| *[[/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]]
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| *[[/Comparison|Comparison of the dry etch systems at Danchip]]
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| == Choose a wet etch ==
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| *[[/Wet Silicon Nitride Etch|Wet Silicon Nitride Etch]]
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| *[[/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]]
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| *[[/KOH Etch|KOH Etch]] - ''Anisotropic silicon etch''
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| *[[/Wet Polysilicon Etch|Wet Polysilicon Etch]] - ''Isotropic silicon etch''
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| *[[/Wet Aluminium Etch|Wet Aluminium Etch]]
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| *[[/Wet Chromium Etch|Wet Chromium Etch]]
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| *[[/Wet Titanium Etch|Wet Titanium Etch]]
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| *[[/Wet Gold Etch|Wet Gold Etch]]
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| *[[/Wet Platinum Etch|Wet Platinum Etch]]
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| = Section under construction [[Image:section under construction.jpg|70px]] =
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| {| {{table}} | | {| {{table}} |
